Wide variety of ACF Laminating and Heat-Seal Bonding systems for all your LCD-Flex-PCB joining requirements. Free of charge application support!
Dima Group
Bonding Technology
Dispense Technology
Most flexible, multiple valve system for all Contour- Coating-Underfill dispense applications. Time-pressure or one-two components …contact us!
Welding Technology
Industry-Leading and High-Tech products as the ultimate solution for your resistance- and seam welding process. Visit our lab and let’s weld together!
SMT Systems Technology
For each SMT process itself and for automated line requests, DIMA offers great solutions with 25 years experience and a huge global installed base!
Soldering Technology
Pulsed-Heated Hot Bar Reflow Soldering for all Flex to PCB, components, cable & connector soldering applications. Highest process control included!
